Senior Package/Module Process Engineer – PEE

Senior Package/Module Process Engineer PEE

Location: Ahmedabad, Gujarat, India

Work Mode: Onsite

Employment Type: Full-Time

Experience: 7 12 Years

Industry: Semiconductor / ATMP / OSAT / Memory Module Manufacturing

Role Overview

We are looking for a Senior Package/Module Process Engineer to develop, qualify, control and improve semiconductor package and memory-module manufacturing processes in a high-volume ATMP environment.

The role requires hands-on experience in semiconductor packaging or module assembly, process characterization, equipment qualification, defect reduction and yield improvement. The engineer will work closely with equipment, manufacturing, product, quality, reliability and materials teams to ensure stable and scalable production.

Key Responsibilities

• Develop, characterize and optimize semiconductor package or memory-module manufacturing processes.
• Own assigned process modules from equipment setup and qualification through high-volume production.
• Establish process recipes, operating parameters, process windows and control limits.
• Execute equipment qualification, process validation and production-release activities.
• Support new-product introduction, package qualification and transfer into volume manufacturing.
• Design and execute DOE studies to improve process capability, quality, yield and throughput.
• Monitor SPC data, process capability, defect trends, scrap, rework and manufacturing excursions.
• Investigate process abnormalities using structured root-cause analysis and statistical methods.
• Develop corrective and preventive actions for recurring process, equipment and material issues.
• Partner with equipment engineers to improve equipment performance, uptime and process repeatability.
• Work with product, quality and reliability teams to resolve package and module failures.
• Qualify new materials, suppliers, consumables, equipment and process changes.
• Prepare and maintain PFMEA, control plans, OCAPs, work instructions and engineering specifications.
• Drive yield improvement, cycle-time reduction, cost optimization and defect-elimination projects.
• Support failure analysis using process data, inspection results and laboratory findings.
• Provide technical guidance and training to junior engineers, technicians and production teams.
• Support internal audits, customer requirements and quality-system compliance.
• Participate in production escalation and engineering support for 24 7 manufacturing operations.
  
  

Required Qualifications

• Bachelor s or Master s degree in Electronics, Electrical, Mechanical, Materials, Chemical, Manufacturing Engineering or a related discipline.
• 7 12 years of experience in semiconductor packaging, assembly, memory modules, SSD manufacturing, ATMP, OSAT or IDM backend operations.
• Strong hands-on experience in at least one major packaging or module-assembly process.
• Demonstrated experience in process development, equipment qualification and high-volume manufacturing support.
• Proven ability to improve yield, reduce defects and stabilize manufacturing processes.
• Experience using DOE, SPC, FMEA, process-capability analysis and structured problem-solving.
• Ability to interpret process data, equipment logs, defect maps and failure-analysis results.
• Experience working with cross-functional and supplier teams.
• Willingness to support production issues in a 24 7 manufacturing environment.
  
  

Technical Skills Semiconductor Package Processes

• Wafer backgrinding, mounting and dicing
• Die preparation and die sorting
• Die attach and die bonding
• Wire bonding
• Flip-chip assembly
• Underfill and encapsulation
• Transfer or compression molding
• Trim and form
• Laser marking
• Package singulation
• Package inspection and handling
  
  

Memory Module Processes

• Surface Mount Technology
• Solder paste printing
• Pick-and-place operations
• Reflow soldering
• Automated Optical Inspection
• X-ray inspection
• In-circuit and functional testing
• PCB and substrate assembly
• DIMM or memory-module manufacturing
• SSD or storage-product assembly
• Mechanical assembly and labelling
  
  

Process Engineering

• Process development and characterization
• Process-window optimization
• Design of Experiments
• Statistical Process Control
• Process Capability Analysis
• Measurement System Analysis
• Equipment and process qualification
• Recipe and parameter management
• Change-point control
• Best Known Method development
  
  

Quality and Problem-Solving

• PFMEA
• Control plans
• OCAP
• 8D problem-solving
• Root-cause analysis
• CAPA
• Fault Tree Analysis
• Pareto analysis
• Process excursion management
• Defect and variation reduction
  
  

Data Analysis

• JMP, Minitab or equivalent statistical software
• Manufacturing data analysis
• Yield and defect trending
• Equipment-log analysis
• Process dashboards
• Excel and data-visualization tools
  
  

Key Manufacturing Metrics

The Engineer Will Be Responsible For Improving

• First-pass yield
• Final yield
• Defect and scrap rate
• Process capability
• Equipment utilization
• Units per hour
• Cycle time
• Rework rate
• Cost per unit
• Process excursion frequency